Product Information

Liquid Epoxy Encapsulant Material for Semiconductors

We offer a lineup of the best products for various process methods including compression mold, underfill, and insulation-displacement connection, and which offer excellent reliability including solder flow resistance, heat resistance, and moisture resistance.

LMC: Liquid Molding Compound

  • High flowability as suitable for large surface areas and thin film molds
  • Liquid at room temperature and able to be dispensed, and dust-free as suitable for clean room environments
  • Capable of low temperature form molding (125°C)
  • Delivers low reflection in large surface area molds with low stress design
  • High reliability
  • High purity
  • Low α line

Main Applications

  • Fan-Out Wafer Level Package(FO-WLP)
  • Over Molding for Chip on Wafer Process of 2.5D and 3D Packages

CUF: Capillary Under Fill

  • Fast penetration speed even in narrow gaps
  • Tip shape during penetration is flat
  • No flow marks after curing
  • High heat resistance
  • High moisture resistance
  • High wet reflow resistance
  • High purity
  • Low α line

NCP:Non-Conductive Paste

  • Ultra-fast curing allows press connection in 5 seconds
  • Excellent workability
  • Supports multiple product types using only a dispenser
  • High heat resistance
  • High moisture resistance
  • High purity

Inquiries

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Inquiries