Nagase ChemteX Corporation

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  • Ag nano ink OAG-series
  • Techrun (Non water-based)
  • Denacol
  • DENATITE(Epoxy Resins for Heavy Electrical Machinery)
  • Denateam PMC SOFTER (Meat Tenderizer)
  • Denatron
  • Denabake RICH (Bread)
  • Liquid Epoxy Encapsulant Material for Semiconductors
  • Al etchant
  • β-Amylase #1500S (Rice Vermicelli)
  • Cu etchant
  • GRX-M series(Positive resist for metal etching)
  • 3D printing material for visible light curing
  • N series(Resist Stripping Agents)
  • Enzyme preparations
  • UV-curable epoxy resin
  • Epoxy Encapsulant Film
  • TEISANRESIN
  • DENATITE(One-part Liquid Epoxy Adhesives)
  • DENATITE(Epoxy Resins for Electrical Insulators)
  • DENATITE(Two-part Liquid Epoxy Adhesives)
  • Denabake RICH (Cake)
  • DENABOND
  • β-Amylase #1500S (Rice Vermicelli)
  • β-Amylase #1500S (White Sauce)
  • ITO etchant
  • NPR9700 series(Positive resist for lift-off processes)
Product and Technical Information
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Company Information

  • Message from the President
  • Company Overview
  • Fields of Business
  • History of Nagase
  • NAGASE Group
  • Company Introduction Video and
    Corporate Advertising

Product and Technical Information

  • Browse by Application
  • Browse by Material
  • Product List
  • Download Catalog
  • Component Technologies
  • esearch and Development

Environment and Health and Safety

  • Basic Environmental Policies
  • Acquisition of ISO14001 Certification
  • Efforts Towards Industrial Health and Safety

Inquiries

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