• Ag nano ink OAG-series
• Techrun (Non water-based)
• Denacol
• DENATITE(Epoxy Resins for Heavy Electrical Machinery)
• Denateam PMC SOFTER (Meat Tenderizer)
• Denatron
• Denabake RICH (Bread)
• Liquid Epoxy Encapsulant Material for Semiconductors
• Al etchant
• β-Amylase #1500S (Rice Vermicelli)
• Cu etchant
• GRX-M series(Positive resist for metal etching)
• 3D printing material for visible light curing
• N series(Resist Stripping Agents)

• Enzyme preparations
• UV-curable epoxy resin
• Epoxy Encapsulant Film
• TEISANRESIN
• DENATITE(One-part Liquid Epoxy Adhesives)
• DENATITE（Epoxy Resins for Electrical Insulators）
• DENATITE(Two-part Liquid Epoxy Adhesives)
• Denabake RICH (Cake)
• DENABOND
• β-Amylase #1500S (Rice Vermicelli)
• β-Amylase #1500S (White Sauce)
• ITO etchant
• NPR9700 series(Positive resist for lift-off processes)