• Ag nano ink OAG-series
• Al etchant
• Cu etchant
• Denacol
• DENATITE(Epoxy Resins for Heavy Electrical Machinery)
• Denatron
• DENATITE(One-part Liquid Epoxy Adhesives)
• DENATITE（Epoxy Resins for Electrical Insulators）
• DENATITE(Two-part Liquid Epoxy Adhesives)
• DENABOND
• Epoxy Sheet Molding Compound

• ITO etchant
• Liquid Epoxy Encapsulant Material for Semiconductors
• N series(Resist Stripping Agents)
• Photoresist for UV Laser Direct Writing―GRX-M Series
• Photoresist for Single Layer Lift-off Processing: NPR9700 Series
• Techrun (Non water-based)
• TEISANRESIN
• UV-curable epoxy resin
• Under Layer Material for Bi-layer Lift-off Processing―BLX Series
• 3D printing material for visible light curing