Alphabet
- Ag nano ink OAG-series
- Techrun (Non water-based)
- Denacol
- DENATITE(Epoxy Resins for Heavy Electrical Machinery)
- Denateam PMC SOFTER (Meat Tenderizer)
- Denatron
- Denabake RICH (Bread)
- Liquid Epoxy Encapsulant Material for Semiconductors
- Al etchant
- β-Amylase #1500S (Rice Vermicelli)
- Cu etchant
- GRX-M series(Positive resist for metal etching)
- 3D printing material for visible light curing
- N series(Resist Stripping Agents)
- Enzyme preparations
- UV-curable epoxy resin
- Epoxy Encapsulant Film
- TEISANRESIN
- DENATITE(One-part Liquid Epoxy Adhesives)
- DENATITE(Epoxy Resins for Electrical Insulators)
- DENATITE(Two-part Liquid Epoxy Adhesives)
- Denabake RICH (Cake)
- DENABOND
- β-Amylase #1500S (Rice Vermicelli)
- β-Amylase #1500S (White Sauce)
- ITO etchant
- NPR9700 series(Positive resist for lift-off processes)