Our products will be exhibited at the NEPCON JAPAN 2021- IC & SENSOR PACKAGING TECHNOLOGY EXPO.
Please visit us at booth W12-12 during the show.

Exhibition Details

Date：Jan 20 (Wed) - 21(Fri), 2021 10:00-18:00 (Last day until 17:00)

Venue：Tokyo Big Sight, Japan

Booth number：W12-12

Our products to be displayed

• UV Curable Epoxy Encapsulant
• Liquid Epoxy Resin for Semiconductor Encapsulant
• Sheet Epoxy Resin for Electronic Component
• Epoxy Sheet for Semiconductor Encapsulant
• Flux Sheet
• Non-Cleaning Flux with Electronic Component Fastener Function
• Innovative Resin：Low Viscosity Benzoxazine
• Exceptional Toughness Cycloolefin Thermoset Resin